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product structure silicon monolithic integrated circuit it is not the radiation - proof design for this product . 1/ 20 tsz02201 - 0p2p0b701230 -1-2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 14? 001 36 vhigh- performance , high- reliability withstand voltage stepping motor driver bd68710efv general description bd68710efv is a bipolar low - consumption driver that driven by pwm current. rated power supply voltage of the device is 36 v, and rated output cu rrent is 1.0 a. para - in driving mode is adopted for input interface, and excitation mode is corresponding to full step mode, half step mode (2 types) and quarter step mode via a built - in dac. in terms of current decay, the fast decay/slow decay ratio may b e set without any limitation, and all available modes may be controlled in the most appropriate way. in addition, the power supply may be driven by one single system, which simplifies the design. features rated output current dc 1.0a low on resistance dmos output para -in drive mode pwm constant current (other oscillation) built - in spike noise cancel function (external noise filter is unnecessary) full - , half (two kinds) - , quarter - step functional ity freely timing excitation mode switch current decay mode switch linear ly variable fast/slow decay ratio normal rotation & reverse rotation switching function power save function built - in logic input pull - down resistor power -on reset function thermal shutdown circuit (tsd) over - current protection circuit ocp under voltage lock out circuit (uvlo) over voltage lock out circuit (ovlo) ghost supply prevention (protects against malfunction when power supply is disconnected) adjacent pins short protection microminiature, ultra - thin and high heat - radiation (exposed metal type) package application s ppc , multi - function printer, laser beam printer, and ink - jet printer monitoring camera and web camera sewing machine photo printer, fax , scanner and mini printe r toy and robot key specifications range of power supply voltage rated output current (continuous) rated output current (peak value) range of operating temperature output on resistance (total of upper and lower resistors) 19 28 [v] 1.0 [a] 1.5 [a] -25 +85 [ ] 1.2 [ ] (typ.) package w(typ.) x d(typ.)x h(max.) htssop- b28 9.70mm x 6.40mm x 1.00mm typical a pplication c ircuit figure.1 a pplication circuit 10 cr 12 mth 7 vcc1 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1 gnd 27 out2b 26 rnf2 rnf1s 4 r nf2s 25 15 phase1 16 i01 18 i11 17 phase2 19 i 02 vref 13 9 gnd 14 ps 20 i 12 datashee t
2 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 out2b rnf1s out1a vcc1 nc mth vref ps nc rnf2s gnd out1b rnf1 rnf2 out2a nc vcc2 i02 i11 phase2 phase1 i01 i12 nc gnd cr nc nc pin configuration [top view] block diagram pin description pin no. pin name function pin no. pin name function 1 gnd ground terminal 15 phase1 phase selection terminal 2 out1b h bridge output terminal 16 i01 vref division ratio setting terminal 3 rnf1 connection terminal of resistor for output current detection 17 phase2 phase selection terminal 4 rnf1s input terminal of cu rrent limit comparator 18 i11 vref division ratio setting terminal 5 out1a h bridge output terminal 19 i02 vref division ratio setting terminal 6 nc non connection 20 i12 vref division ratio setting terminal 7 vcc1 power supply terminal 21 nc non connec tion 8 nc non connection 22 vcc2 power supply terminal 9 gnd ground terminal 23 nc non connection 10 cr c onnection terminal of cr for setting chopping frequency 24 out2a h bridge output terminal 11 nc non connection 25 rnf2s input terminal of current l imit comparator 12 mth current decay mode setting terminal 26 rnf2 connection terminal of resistor for output current detection 13 vref output current value setting terminal 27 out2b h bridge output terminal 14 ps power save terminal 28 nc non connection 7 8 6 5 3 4 2 1 figure. 2 pin c onfiguration 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 figure.3 block diagram i01 i11 i02 predriver 7 vcc1 blank time pwm control 2bit dac tsd uvlo regulator reset 9 gnd 10 cr 12 mth 14 ps 15 phase1 16 1 8 1 7 19 vref 13 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1 gnd 27 out2b 26 rnf2 control logic mix decay control ocp osc rnf1s 4 rnf2s 25 ovlo rnf1s rnf2s phase2 i12 20 translator
3 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 absolute maximum rat ings (ta=25 ) item symbol rated value unit supply voltage v cc1,2 - 0.2 +36.0 v input voltage for control pin v in - 0.2 +5.5 v rnf maximum voltage v rnf 0.7 v maximum output current (dc ) i out 1 .0 a/ phase maximum output current (peak) (note 1 ) i outpeak 1 . 5 a/ phase operating temperature range t opr -25 +85 storage temperature range t stg -55 +150 (note 1 ) pulse width tw Q 1ms, duty 20%. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can ei ther be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, i n case the ic is operated over the absolute maximum ratings. reco mmended operating range ( ta = -25 +85) item symbol rated value unit supply voltage v cc1,2 1928 v maximum output current (dc) i out 0 . 7 a/ phase
4 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 thermal resistance ( note 2 ) parameter symbol thermal resistance (typ) u nit 1s ( note 4 ) 2s2p ( note 5 ) htssop - b28 junction to ambient ja 107.0 25.1 c /w junction to top characterization parameter ( note 3 ) jt 6 3 c /w (note 2 ) based on jesd 51 - 2a(still-air) (note 3 ) the thermal characterization parameter to report the diffe rence between junction temperature and the temperature at the top center of the outside surface of the component package. (note 4 ) using a pcb board based on jesd 51 - 3. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.5 7mmt to p copper pattern thickness footprints and t races 70 m (note 5 ) using a pcb board based on jesd 51 -7. layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt to p 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m
5 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 electrical characteristics ( unless otherwise specified ta=25, v cc1,2 =24v ) item symbol specification unit condition minimum standard maximum [ whole ] circuit current at sta ndby i ccst - 0.8 2.0 ma ps=l circuit current i cc - 2.0 5.0 ma ps=h, vref=3v [ control input ] ( phase1, phase2 ) h - level input voltage v in1h 2.8 - - v l - level input voltage v in1l - - 0.6 v input hysteresis voltage v in1hys - 0.85 - v h - level input cur rent i in1h 35 50 100 a v in1 =5v l - level input current i in1l -10 0 - a v in1 =0v [ control input ] (ps, i01, i11, i02, i12) h - level input voltage v in2h 2.0 - - v l - level input voltage v in2l - - 0.8 v h - level input current i in2h 35 50 100 a v in2 =5v l -l evel input current i in2l -10 0 - a v in2 =0v [ output (out1a, out1b, out2a, out2b)] output on resistance r on - 1.2 1.5 i out = 1.0a ( total of upper and lower resistors ) output leak current i leak - - 10 a [ current control ] rnfxs input current i rnfs -2 .0 - 0.1 - a rnfxs=0v rnfx input current i rnf -80 -40 - a rnfx=0v vref input current i vref - 2.0 - 0.1 - a vref=0v vref input voltage range v vref 0 - 3.0 v mth input current i mth - 2.0 - 0.1 - a mth=0v mth input voltage range v mth 0 - 3.5 v minimum on time (blank time) t onmin 0.3 0.7 1.5 s c=1000pf, r=39k comparator threshold v cth 0.57 0.60 0.63 v vref=3v
6 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 function explanation ps/power saving pin ps can make circuit standby state and make motor output open. when ps=l ? h, please be careful because there is a delay of 40s (max.) b efore it is returned from standby state to normal state and the motor output becomes active. ps state l standby state (reset) h active phase 1, phase2 /phase selection terminal this is the pin to decide output logic. phase1 phase2 out1a out1b out2a out2b l l l h l h h l h l l h l h l h h l h h h l h l i01,i02,i11,i12 / vref division ratio setting pin these terminals determine internal 2bit - dac o utput voltage for current limit . (i0x, i1x)=(h, h): motor outputs are open. vcc1,vcc2 power supply terminal motor?s drive current is flowing in it, so please wire in such a way that the wire is thick & short and has low impedance. voltage vcc may have great fluctuation, so please arrange th e bypass capacitor of about 100 ? 470 f as close to the terminal as possible and adjust in such a way that the voltage vcc is stable. please increase the capacity if needed especially when a large current is used or those motors that have great back electro motive force are used. in addition, for the purpose of reducing of power supply?s impedance in wide frequency bandwidth, parallel connection of multi - layered ceramic capacitor of 0.01 ? 0.1 f etc is recommended. extreme care must be used to make sure that t he voltage vcc does not exceed the rating even for a moment. vcc1 & vcc2 are shorted inside ic, so please be sure to short externally vcc1 & vcc2 when using. if used without shorting, malfunction or destruction may occur because of concentration of current routes etc., so please make sure that they are shorted when in use. still more, in the power supply terminal, there is built - in clamp component for preventing of electrostatic destruction. if steep pulse or voltage of surge more that maximum absolute rati ng is applied, this clamp component operates, as a result there is the danger of destruction, so please be sure that the maximum absolute rating must not be exceeded. it is effective to mount a zener diode of about the maximum absolute rating. moreover, th e diode for preventing of electrostatic destruction is inserted between vcc terminal and gnd terminal, as a result there is the danger of ic destruction if reverse voltage is applied between vcc terminal and gnd terminal, so please be careful. gnd ground terminal in order to reduce the noise caused by switching current and to stabilize the internal reference voltage of ic, please wire i n such a way that the wiring impedance from this terminal is made as low as possible to achieve the lowest ele ctrical potential no matter what operating state it may be. out1a,out1b,out2a,out2b h bridge output terminal motor?s drive current is flowing in it, so please wire in such a way that the wire is thick & short and has low impedance. it is also effective t o add a schottky diode if output has positive or negative great fluctuation when large current is used etc, for example, if counter electromotive voltage etc. is great. moreover, in the output terminal, there is built - in clamp component for preventing of e lectrostatic destruction. if steep pulse or voltage of surge more tha n maximum absolute rating is applied, this clamp component operates, as a result there is the danger of even destruction, so please be sure that the maximum absolute rating must not be ex ceeded. i0x i1x output current level (%) l l 100 h l 67 l h 33 h h 0
7 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 rnf1,rnf2 connection terminal of resistor for detecting of output current please connect the resistor of 0.1 ? 0.3 for current detection between this terminal and gnd. in view of the power consumption of the current - detecting resistor, pl ease determine the resistor in such a way that w=i out2 ? r[w] does not exceed the power dissipation of the resistor. in addition, please wire in such a way that it has a low impedance and does not have a impedance in common with other gnd patterns because mo tor?s drive current flows in the pattern through rnf terminal current - detecting resistor gnd. please do not exceed the rating because there is the possibility of circuits? malfunction etc. if rnf voltage has exceeded the maximum rating (0.7v). moreover, pl ease be careful because if rnf terminal is shorted to gnd, large current flows without normal pwm constant current control, then there is the danger that ocp or tsd will operate. if rnf terminal is open, then there is the possibility of such malfunction as output current does not flow either, so please do not let it open. rnf1s,rnf2s input terminal of current limit comparator in this series, rnfs terminal, which is the input terminal of current limit comparator, is independently arranged in order to decrease the lowering of current - detecting accuracy caused by the wire imp edance inside the ic of rnf terminal. therefore, please be sure to connect rnf terminal and rnfs terminal together when using in the case of pwm constant current control. in addition, because the wires from rnfs terminal is connected near the current - detec ting resistor in the case of interconnection, the lowering of current - detecting accuracy, which is caused by the impedance of board pattern between rnf terminal and the current - detecting resistor, can be decreased. moreover, please design the pattern in su ch a way that there is no noise plunging. in addition, please be careful because if terminals of rnf1s & rnf2s are shorted to gnd, large current flows without normal pwm constant current control and, then there is the danger that ocp or tsd will operate. vref output current value setting terminal this is the terminal to set the output current value. the output current value can be set by vref voltage and current - detecting resistor (rnf resistor). output current i out [a] = {vref [v] / 5(division ratio insi de ic)} / rnf [] please avoid using it with vref terminal open because if vref terminal is open, the input is unsettled, and the vref voltage increases, and then there is the possibility of such malfunctions as the setting current increases and a large cu rrent flows etc. please keep to the input voltage range because if the voltage of over 3v is applied on vref terminal, then there is also the danger that a large current flows in the output and so ocp or tsd will operate. besides, please take into consider ation the outflow current (max.2a) if inputted by resistance division when selecting the resistance value. the minimum current, which can be controlled by vref voltage, is determined by motor coil?s l & r values and minimum on time because there is a mini mum on time in pwm drive. cr connection terminal of cr for setting chopping frequency this is the terminal to set the chopping frequency of output. please connect the external c(470p 1500pf) and r(10k 200k ) between this terminal and gnd. please refer t o p9. please interconnect from external components to gnd in such a way that the interconnection does not have impedance in common with other gnd patterns. in addition, please carry out the pattern design in such ways as keeps such steep pulses as square w ave etc. away and that there is no noise plunging. please mount the two components of c and r if being used by pwm constant current control because normal pwm constant current control becomes impossible if cr terminal is open or it is biased externally. mth current decay mode - setting terminal this is the terminal to set the current decay mode. current decay mode can be optionally set according to input voltage. mth terminal input voltage [v] current decay mode 0~0.3 slow decay 0.4~1.0 mix decay 1.5~3.5 fast decay please connect to gnd if using at slow decay mode. please avoid using with mth terminal open because if mth terminal is open, the input is unsettled, and then there is the danger that pwm operation becomes unstable. besides, please take into c onsideration the outflow current (max.2a) if inputted by resistance division when selecting the resistance value. nc terminal this terminal is unconnected electrically with ic internal circuit.
8 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 thermal shutdown (tsd) this ic has a built - in thermal shutdown cir cuit for thermal protection. when the ic?s chip temperature rises above 175 (typ.), the motor output becomes open. also, when the temperature returns to under 150 (typ.), it automatically r eturns to normal operation. however, even when tsd is in operation , if heat is continued to be added externally, heat overdrive can lead to destruction. over current protection (ocp) this ic has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other o r vcc - motor output or motor output - gnd is shorted. this circuit latches the motor output to open condition when the regulated threshold current flows for 4s (typ.). it returns with power reactivation or a reset of the ps terminal. the over current protect ion circuit?s only aim is to prevent the destruction of the ic from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. therefore, sets should not be designed to take into account this circui t?s functions. after ocp operating, if irregular situations continues and the return by power reactivation or a reset of the ps terminal is carried out repeat ed ly, then ocp operates repeat ed ly and the ic may generate heat or otherwise deteriorate. when the l value of the wiring is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. also, when curr ent which is over the output current rating and under the ocp detection current flows, the ic can heat up to over tjmax=150 and can deteriorate, so current which exceeds the output rating should not be applied. under voltage lock out (uvlo) this ic has a built - in under voltage lock out function to prevent false operation such as ic output during power supply under voltage. when the applied voltage to the vcc terminal goes under 15v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis to prevent false operation by noise etc. please be aware that this circuit does not operate during power save mode. also, the electrical angle is reset when the uvlo circuit operates during para - in drive mode. over voltage lock out (ovlo) this ic has a built - in over voltage lock out function to protect the ic output and the motor during power supply over voltage. when the applied voltage to the vcc terminal goes over 32v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis and a 4s (typ.) mask time to prevent false operation by noise etc. although this over voltage locked out circuit is built - in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. please be aware that this circuit does not operate during power save mode. ghost supply prevention (protects against malfunction when power supply is disconnected) i f a signal (logic input, mth , vref ) is input when there is no power supplied to this ic, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the vcc to this ic or to another ic?s power supply. therefore, there is no malfunction of the circuit even when voltage is supplied to these input terminals while there is no power supply.
9 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 pwm constant current control 1) current control operation when the output transistor is turned on, the output current increases, raising the voltage over the current sense resistor. when the voltage on the rnf pin reaches the voltage value set by the inte rnal 2 - bit dac and the vref input voltage, the current limit comparator engages and enters current decay mode. the output is then held off for a period of time determined by the rc time constant connected to the cr pin. the process repeats itself constantl y for pwm operation. 2) noise - masking function in order to avoid misdetection of output current due to rnf spikes that may occur when the output turns on, the ic employs an automatic current detection - masking period (t onmin ), during which current detection is disabled immediately after the output transistor is turned on. this allows for constant - current drive without the need for an external filter. this noise - masking period defines the minimum on - time for the motor output transistor. 3) cr timer the cr fil ter connected to the cr pin is repeatedly charged and discharged between the vcrh and vcrl levels. the output of the internal comparator is masked while charging from vcrl to vcrh in order to cancel noise. (as mentioned above, this period defines the minim um on - time of the motor output transistor.) the cr terminal begins discharging once the voltage reaches vcrh. when the output current reaches the current limit during this period (i.e. rnf voltage reaches the decay trigger voltage), then the ic enters deca y mode. the cr continues to discharge during this period until it reaches vcrl, at which point the ic output is switched back on. the current output and cr pin begin charging simultaneously. the cr charge time (t onmin ) and discharge time (t discharge ) are s et by external components, according to the following formulas. the total of t onmin and t discharge yield the chopping period, t chop . t onmin [s] Pc ?r' ? r / (r'+r) ? ln[(vcr- 0.4)/(vcr - 1.0)] vcr=v ? r/(r'+r) v: internal regulator voltage 5v(typ.) r': cr terminal in ternal impedance 5k (typ.) t discharge [s] Pc ? r ? ln[(1+ )/0.4] :see the right graph. t chop [s] Pt onmin + t discharge figure 4 timing chart of cr voltage, rnf voltage and output curr ent attach a resistor of at least 10 k to the cr terminal (10 k~200 k recommended) as lower values may keep the rc from reaching the vcrh voltage level. a capacitor in the range of 470 pf ? 1500 pf is also recommended. as the capacitance value is increa sed, however, the noise - masking period (t onmin ) also increases, and there is a risk that the output current may exceed the current limit threshold due to the internal l and r components of the output motor coil. also, ensure that the chopping period (t chop ) is not set longer than necessary, as doing so will increase the output ripple, thereby decreasing the average output current and yielding lower output rotation efficiency. the optimal value should reduce the motor drive noise while keeping distortion of the output current waveform to a minimum. cr voltage rnf voltage output current spike noise current limit value gnd minimum o n time t onmin vcrh(1.0v typ.) vc rl(0.4v typ.) gnd 0ma current limit value chopping period t chop discharge time t discharge 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0 500 1000 1500 2000 c[pf] [v]
10/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 current decay mode the ic allows for a mixed decay mode in which the ratio of fast and slow decay can be optionally set. the following diagrams show the operating state of each transistor and the regenerative curr ent path during attenuation for each decay mode: figure 5 route of regenerated current during current decay the merits of each decay mode are as follows: slow decay during current attenuation, the voltage between motor coils is small and the regeneration current decreases slowly, decreasing the output current ripple. this is favorable for keeping motor torque high. however, due to fall - off of current contr ol characteristics in the low - current region, or due to reverse emf of the output motors exhibited when using high - pulse - rate half - step or quarter - step modes, the output current increases, distorting the output current waveform and increasing motor vibrati on. thus, this decay mode is most suited to full - step modes, or low - pulse - rate half - step or quarter - step modes. fast decay fast decay decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of the output current waveform. however, fast decay yields a much larger output current ripple, which decreases the overall average cur rent running through the motor. this causes two problems: first, the motor torque decreases (increasing the current limit value can help eliminate this problem, but the rated output current must be taken into consideration); and second, the power loss with in the motor increases and thereby radiates more heat. if neither of these problems is of concern, then fast decay can be used for high - pulse rate half - or quarter - step drive. additionally, this ic allows for a mixed decay mode that can help improve upon problems that arise from using fast or slow decay alone. in this mode, the ic switches automatically between slow and fast decay, improving the current control characteristics without increasing the output current ripple. the ratio of fast to slow decay is set externally via the voltage input to the mth pin; therefore, the optimal mix of slow and fast decay can be achieved for each application. mixed decay mode operates by splitting the decay period into two sections, the first x%(t1 - t2) of which operates t he ic in slow decay mode, and the remainder(t2 - t3) of which operates in fast decay mode. however, if the output current (i.e., the voltage on the rnf pin) does not reach the set current limit during the first x% (t1 - t2) decay period, the ic operates in fas t decay mode only. mth voltage [v] current decay mode 0~0.3 slow decay 0.4~1.0 mix decay 1.5~3.5 fast decay figure 6 relation between cr terminal voltage, mth voltage, and output current during mix ed decay on off o ff on m on off o ff fast decay slow decay on off o ff on m on on o ff off output on time current decay time cr voltage current limit v alue output current 0a gnd 1.0v 0.4v slow decay fast decay chopping period t chop mt h voltage t1 t2 t3
11 / 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 par allel - in drive mode it is possible to drive stepping motor with full step, half step, and quarter step by inputting the following motor control signals using parallel - in drive mode. examples of control sequence and torque vector control led by 2 logic signals of phase1 & phase2 controlled by 4 logic signals of phase1,phase2, i01(i11), and i02(i12) half step a 2 8 6 4 100% 67% 33% 1 5 7 3 out1a out2b out2a out1b 100% 67% 33% - 33% - 67% - 100% 100% 67% 33% - 33% - 67% - 100% 100% 67% 33% -33% -67% - 100% 100% 67% 33% - 33% - 67% -100% i01 i02 i11 phase1 phase2 i12 iout(ch1) iout(ch2) i11 i01 i02 phase1 phase2 i12 iout(ch2) iout(ch1) full step 4 3 2 100% 67% 33% out2b out1b out2a out1a 1
12/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 controlled by 6 logic signals of phase1,phase2, i01,i11,i02, and i12 controlled by 6 logic signals of phase1,phase2, i01,i11,i02, and i12 half step b quarter step 2 8 6 4 100% 67% 33% 1 5 7 3 out1a out2b out2a out1b out1a 3 15 11 7 100% 67% 33% 2 9 13 5 16 14 12 6 8 1 4 2 10 out1b out2a out2b 100% 67% 33% -33% -67% - 100% 100% 67% 33% -33% -67% -100% 100% 67% 33% -33% -67% - 100% 100% 67% 33% - 33% - 67% -100% iout(ch2) iout(ch1) i02 i12 i01 i11 phase1 phase2 i01 i11 phase1 phase2 iout(ch2) iout(ch1) i02 i12 ? ? ? ? ? ?
13/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 power dissipation please confirm that the ic?s chip temperature tj is not over 150 , while considering the ic?s power consumption (w) and ambient temperature (ta). when tj=150 is exceeded the functions as a semiconductor do not operate and problems such as parasitism and leaks occur. constant use under these circumstances leads to deterioration and eventually destruction of the ic. tjmax=150 must be strictly obeyed under all circumstances. thermal calculation the ic?s consumed power can be estimated ro ughly with the power supply voltage (v cc ), circuit current (i cc ), output on resistance (r onh ?r onl ) and motor output current value (i out ). the calculation method during full step drive, slow decay mode is shown here: consumed power of the vcc [w] = v cc [v] ? i cc [a] ??????? consumed power of the output dmos [w] = (r onh [ ] + r onl [ ]) ?i out [a] 2 ? 2[ch] ? on_duty during output on + (2 ?r onl [ ]) ? i out [a] 2 ? 2[ch] ? (1 - on_duty) ??????? during current decay however, on duty: pwm on duty = t on / (t chop ) t on varies dependi ng on the l and r values of the motor coil and the current set value. please confirm by actual measurement, or make an approximate calculation. t chop is the chopping period, which dep ends on the external cr. see p.8 for details . ic number upper pchdmos on resistance r onh [ ] (typ.) lower nchdmos on resistance r onl [ ] (typ.) bd68710efv 0. 70 0. 50 consumed power of total ic w_total [w] = + junction temperature tj = ta[ ] + ja [ /w] ? w_total [w] however, the thermal resistance value ja [ /w] differs great ly depending on circuit board conditions. refer to the derating curve on p.17 .also, we are taking measurements of thermal resistance value ja of boards actually in use. please feel free to contact our salesman. the calculated values above are only theoreti cal. for actual thermal design, please perform sufficient thermal evaluation for the application board used, and create the thermal design with enough margin to not exceed tjmax=150 .although unnecessary with normal use, if the ic is to be used under espec ially strict heat conditions, please consider externally attaching a schottky diode between the motor output terminal and gnd to abate heat from the ic. temperature monitoring in respect of bd68710efv , t here is a way to approximately measure the chip tem perature by using the electrostatic discharge protection diode of the logic terminal (i0x or i1x) can be used when at l state. temperature monitoring using this method is only for evaluation and experimenting purposes, and must not be used in actual usage conditions. (1) measure the terminal voltage when a current of i diode =50a passes from the i0 x or i1x terminal to the gnd without supplying vcc to the ic. this measurement is the v f voltage of the internal diode. (2) measure the temperature characteristics of this terminal voltage. v f has a linear negative temperature factor against temperature. with these results of temperature characteristics, chip temperature ma y be calibrated from the i0x or i1x terminal voltage. (3) supply vcc, monitor the i0x or i1x te rminal voltage while running the motor, and the chip temperature can be approximated from the results of (2). figure.7 model diagram for measuring chip temperature - vf[mv] 25 150 chip temperature t j [ ] i0x or i1x vf internal circuit idiode
14/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 example for applied circuit figure.8 b lock diagram and applied circuit diagram 0.2 0.2 resistor for c urrent detection setting range is 0.1 ? 0.3 . refer to p. 7 for detail. 39k 1000pf set the chopping frequenc y. setting range is c:470pf 1500pf r:10k ? 200k refer to p. 7 , 9 for detail. bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) refer to p. 6 for detail. be sure to short vcc1 & vcc2. resistor for current detection setting range is 0.1 ? 0.3 . refer to p. 7 for detail. predriver 7 vcc1 blank time pwm control translator 2bit dac tsd uvlo regulator reset 9 gnd 10 cr 12 mth 14 ps 15 phase1 18 i11 19 i02 16 i01 20 i12 vref 13 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1 gnd 27 out2b 26 rnf2 control logic mix decay control ocp osc rnf1s 4 rnf2s 25 ovlo rnf1s rnf2s 0.1 f 100 f set the output current. input by resistor division. refer to p. 6 for detail. set the current decay mode. slow decay ? connect to gnd. mix decay ? input by resistor division. refer to p. 7 , 10 for detail. logic in put terminal see p6 for detail. power save terminal refer to p. 6 for detail. 17 phase2
15/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 input output equivalent circuit diagram figure.9 input output equivalent circuit diagram 10k 100k ps i01 i11 i02 i12 vref mth 5k vcc circuitry rnf1, rnf2 out1b out2b out1a out2a rnf1s rnf2s 5k cr 5k 5k 5k vreg (internal regulator) 215k 100k phase1 phase2 10k
16/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 operational notes 1. reverse c onnectio n of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. po wer s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground p in at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the applicati on board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce l ine impedance. 5. thermal c onsideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction t emperature rating . 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . t he e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the inter nal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromag netic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may su bject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may res ult in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional sol der bridge deposited in between pins during assembly to name a few.
17/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacita nce. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p -n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dama ge. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 10. example of monolithic ic structure 13. thermal s hutdown c ircuit( tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) wi ll rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absol ute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over c urrent p rotection c ircuit (ocp) this ic incorporates an integrated overcurre nt protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 15. operation u nder s trong e lectromagnetic f ield ( bd68710efv ) the ic is not designed for us ing in the presence of strong electromagnetic field. be sure to confirm that no malfunction is found when using the ic in a s trong electromagnetic field. 16. metal on the backside (define the side where product markings are printed as front) ( bd68710efv ) the metal on the backside is shorted with the backside of ic chip therefore it should be connected to gnd. be aware that here is a possibility of malfunction or destruction if it is shorted with any potential other than gnd.
18/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 selecting a model name when ordering b d 6 8 7 1 0 e f v - e 2 rohm model package type efv : htssop - b28 packing, forming specification e2 : reel - wound e mbossed taping marking diagram htssop - b2 8 (top view) bd68710efv part number marking lot number 1pin mark
19/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 2016 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15? 001 physical dimension , tape and reel information package name htssop - b28
20/ 20 bd68710efv tsz02201 - 0p2p0b701230 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. 10.jun.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 10. j un .201 6 001 new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd68710efv package htssop-b28 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd68710efv - web page

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